pb rohs eccm1c-20-24.000m tr eccm1 c -20 -24.000m tr series rohs compliant (pb-free) 5.0mm x 7.0mm ceramic smd crystal frequency tolerance/stability 30ppm at 25c, 50ppm over 0c to +70c mode of operation at-cut fundamental packaging options tape & reel nominal frequency 24.000mhz load capacitance 20pf parallel resonant electrical specifications nominal frequency 24.000mhz frequency tolerance/stability 30ppm at 25c, 50ppm over 0c to +70c aging at 25c 3ppm/year maximum load capacitance 20pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 30 ohms maximum mode of operation at-cut fundamental drive level 50watts maximum, 50watts correlation spurious response -3db minimum (measured from fo to fo +5000ppm) storage temperature range -40c to +85c insulation resistance 500 megaohms minimum (measured at 100vdc) environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 cover/ground 3 crystal 4 cover/ground line marking 1 e24.00 e=ecliptek designator 2 xxxxx xxxxx=ecliptek manufacturing identifier www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 1 of 5 marking orient a tion 7.00 0.15 5.00 0.15 1.3 max 1.0 0.2 (x4) note: chamf er and inde x mar k not sho wn. 4.6 0.2 1.2 0.1 (x4) 2.54 0.20 2 3 4 1 2 3 4 1
eccm1c-20-24.000m tr 3.6 1.1 1.4 (x4) 2.2 (x4) www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 2 of 5 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
dia 50 min dia 20.2 min dia 13.0 0.2 2.5 min width 10.0 min depth t ape slot in core f or t ape star t dia 40 min access hole at slot location 1.5 min tape & reel dimensions *compliant to eia 481a eccm1c-20-24.000m tr 16.0 0.3 7.5 0.2 6.75 0.20 4.0 0.2 2.0 0.2 8.0 0.2 5.4 0.1 dia 1.5 0.1 7.9 0.1 0.30 0.05 1.7 0.1 22.4 max 360 max quantity per reel: 1,000 units 16.4 +2.0/-0.0 www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 3 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm1c-20-24.000m tr high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm1c-20-24.000m tr low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev t 8/12/2010 | page 5 of 5
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